HIGH-SPEED FILLING METHOD FOR COPPER

To provide a technique of increasing a rate of filling holes or grooves formed in a substrate, by changing the temperature, the concentration, the current density, and the other conditions of the ordinary copper plating. A method for filling holes or grooves formed in a substrate by copper plating a...

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Bibliographic Details
Main Authors OMORI Takafumi, YASUDA Kiroki, ANDO Syunsuke
Format Patent
LanguageEnglish
Published 16.02.2017
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:To provide a technique of increasing a rate of filling holes or grooves formed in a substrate, by changing the temperature, the concentration, the current density, and the other conditions of the ordinary copper plating. A method for filling holes or grooves formed in a substrate by copper plating at a high speed, containing: immersing the substrate having the holes or grooves in an acidic copper plating solution containing a copper ion, a sulfate ion, and a halide ion, at from 30 to 70° C.; and plating the substrate at a current density of 3 A/dm2 or more by using an insoluble electrode as an anode.
Bibliography:Application Number: US201415306261