MOSFET WITH ULTRA LOW DRAIN LEAKAGE

A semiconductor device includes a monocrystalline substrate configured to form a channel region between two recesses in the substrate. A gate conductor is formed on a passivation layer over the channel region. Dielectric pads are formed in a bottom of the recesses and configured to prevent leakage t...

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Bibliographic Details
Main Authors Sadana Devendra K, de Souza Joel P, Kim Jeehwan, Fogel Keith E
Format Patent
LanguageEnglish
Published 02.02.2017
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Summary:A semiconductor device includes a monocrystalline substrate configured to form a channel region between two recesses in the substrate. A gate conductor is formed on a passivation layer over the channel region. Dielectric pads are formed in a bottom of the recesses and configured to prevent leakage to the substrate. Source and drain regions are formed in the recesses on the dielectric pads from a deposited non-crystalline n-type material with the source and drain regions making contact with the channel region.
Bibliography:Application Number: US201615287854