METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

• Main Authors: Miller Jeffrey B, Stack Marc R, Hendron Jeffrey James, Brugarolas Brufau Teresa, Tran Tony Quan, Wank Andrew, Tong Yuhua, Lugo Diego, Kozhukh Julia, Veneziale David Michael, Qian Bainian, Jacob George C
• Format: Patent
• Language: English
• Published: 29.12.2016
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 5 to 1,000 m/sec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.