ADHESIVE COMPOSITION AND DISPLAY DEVICE

• Main Authors: Hwang Hyeondeuk, Moon Sangeun, So Kyoungsub
• Format: Patent
• Language: English
• Published: 15.12.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-LINEAR OPTICS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PAINTS; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; USE OF MATERIALS AS ADHESIVES

An adhesive composition includes: a monomer in an amount of about 25 wt % to about 50 wt %; an oligomer in an amount of about 25 wt % to about 40 wt %; a binder resin in an amount of about 10 wt % to about 40 wt %; and a photopolymerization initiator in an amount of about 1 wt % to about 10 wt % with respect to the total weight of the adhesive composition. The monomer may include acrylic acid and isobornyl acrylate, the oligomer may include silicone acrylate, and the photopolymerization initiator may include a first photoinitiator having a photosensitive wavelength of about 210 nm to about 290 nm and a second photoinitiator having a photosensitive wavelength of about 300 nm to about 390 nm.