PROCESS FOR PREPARATION OF SELF HEALING MICROCAPSULES

• Main Authors: Jadhav Arun Savalaram, Shukla Parshuram Gajanan
• Format: Patent
• Language: English
• Published: 01.12.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; THEIR RELEVANT APPARATUS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

The present invention disclosed a process for the preparation of microcapsules containing epoxy resin which comprises water-insoluble and/or water-soluble components prepared by in-situ polymerization using non-aqueous continuous phase which acts as healing agents for the micro-cracks when embedded in composite structures.