MOLD TRANSFER ASSEMBLIES AND METHODS OF USE
A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
24.11.2016
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Subjects | |
Online Access | Get full text |
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Summary: | A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold. |
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Bibliography: | Application Number: US201514787133 |