MOLD TRANSFER ASSEMBLIES AND METHODS OF USE

A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the...

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Bibliographic Details
Main Authors Clark Michael, Ownby Clayton Arthur, Cook, III Grant O, Olsen Garrett T, Atkins William Brian
Format Patent
LanguageEnglish
Published 24.11.2016
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Summary:A mold transfer assembly includes a transfer housing providing an interior defined by one or more sidewalls and a top. The transfer housing is sized to receive and encapsulate a mold as the mold is moved between a furnace and a thermal heat sink. An arm is coupled to the transfer housing to move the transfer housing and the mold encapsulated within the transfer housing between the furnace and a thermal heat sink. The transfer housing exhibits one or more thermal properties to control a thermal profile of the mold.
Bibliography:Application Number: US201514787133