SELF-ALIGNED SOURCE AND DRAIN REGIONS FOR SEMICONDUCTOR DEVICES

A method for forming a semiconductor device includes patterning a gate conductor, formed on a substrate, and a two-dimensional material formed on the gate conductor. Recesses are formed adjacent to the gate conductor in the substrate, and a doped layer is deposited in the recesses and over a top of...

Full description

Saved in:
Bibliographic Details
Main Authors MAURER SIEGFRIED L, HEKMATSHOARTABARI BAHMAN, de SOUZA JOEL P, KIM JEEHWAN, SADANA DEVENDRA K
Format Patent
LanguageEnglish
Published 17.11.2016
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A method for forming a semiconductor device includes patterning a gate conductor, formed on a substrate, and a two-dimensional material formed on the gate conductor. Recesses are formed adjacent to the gate conductor in the substrate, and a doped layer is deposited in the recesses and over a top of the two-dimensional material. Tape is adhered to the doped layer on top of the two-dimensional material. The tape is removed to exfoliate the doped layer from the top of the two-dimensional material to form source and drain regions in the recesses.
Bibliography:Application Number: US201615224035