POWER SYSTEM-ON-CHIP ARCHITECTURE

A lighting device is provided. The lighting device includes a substrate, integrated circuits (22′, 24), embedded passive components (26, 27), and a lighting component (22), the device being arranged in an architecture having three layers: an integrated circuits layer (11) including the integrated ci...

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Bibliographic Details
Main Authors SIN Johnny Kin On, YUE Chik Patrick, LAU Kei May
Format Patent
LanguageEnglish
Published 03.11.2016
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF
HEATING
LIGHTING
MECHANICAL ENGINEERING
PHYSICS
SEMICONDUCTOR DEVICES
SIGNALLING
STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR
TRAFFIC CONTROL SYSTEMS
WEAPONS
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Summary:A lighting device is provided. The lighting device includes a substrate, integrated circuits (22′, 24), embedded passive components (26, 27), and a lighting component (22), the device being arranged in an architecture having three layers: an integrated circuits layer (11) including the integrated circuits (22′, 24), wherein the integrated circuits layer (11) is integrated on a first side of the substrate; an embedded passive components layer (12) including the embedded passive components (26, 27), wherein the embedded passive components (26, 27) are embedded in grooves formed in the substrate and wherein the embedded passive components are connected to the integrated circuits (22′, 24) through vias (28) in the substrate; and a bonded layer (13), including the lighting component (22), the lighting component (22) being connected to the integrated circuit layer (11) through flip-chip bonding or monolithic integration.
Bibliography:Application Number: US201414779853