WIRING SUBSTRATE

A wiring substrate includes a first wiring substrate, a first insulation layer covering the first wiring layer, a second insulation layer stacked on the first insulation layer, and a cavity extending through the second insulation layer and exposing a portion of the upper surface of the first insulat...

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Bibliographic Details
Main Authors KOBAYASHI Kazuhiro, KUSAMA Yasuhiko, SATO Junji
Format Patent
LanguageEnglish
Published 03.11.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A wiring substrate includes a first wiring substrate, a first insulation layer covering the first wiring layer, a second insulation layer stacked on the first insulation layer, and a cavity extending through the second insulation layer and exposing a portion of the upper surface of the first insulation layer. The cavity includes an opening, which is defined by an upper portion of a stepped inner wall surface of the second insulation layer, and a recess, which is defined by a lower portion of the stepped inner wall surface that contacts the upper surface of the first insulation layer. The recess is wider than the opening. An electronic component is mounted on the upper surface of the first insulation layer. The opening and the recess are filled with a third insulation layer that covers the electronic component and the second insulation layer.
Bibliography:Application Number: US201615095334