LIQUID COOLING HEAT DISSIPATION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

A liquid cooling heat dissipation structure includes a heat conduction module, a heat dissipation module, and a liquid supply module. The heat conduction module includes a first heat-conducting substrate contacting at least one heat-generating source and a second heat-conducting substrate disposed o...

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Bibliographic Details
Main Authors TSAI SHUI-FA, CHANG SHIH-YI
Format Patent
LanguageEnglish
Published 20.10.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED OPERATIONS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Summary:A liquid cooling heat dissipation structure includes a heat conduction module, a heat dissipation module, and a liquid supply module. The heat conduction module includes a first heat-conducting substrate contacting at least one heat-generating source and a second heat-conducting substrate disposed on the first heat-conducting substrate. The heat dissipation module is disposed on the heat conduction module. The liquid supply module is detachably disposed on the heat conduction module to cover the heat dissipation module. The liquid supply module includes an external cover body and a radial-flow centrifugal impeller detachably disposed on the external cover body. The heat conductivity coefficient and the temperature uniformity of the heat conduction module is larger than the heat conductivity coefficient and the temperature uniformity of the heat dissipation module, and the heat-dissipating area of the heat dissipation module is larger than the heat-dissipating area of the heat conduction module.
Bibliography:Application Number: US201514689157