METHOD FOR CONTROLLING SURFACE CHARGE ON WAFER SURFACE IN SEMICONDUCTOR FABRICATION

A method for processing a semiconductor wafer is provided. The method includes performing a discharging process over the semiconductor wafer in a discharging chamber which is enclosed. The method further includes processing the semiconductor wafer by use of a first processing module after the discha...

Full description

Saved in:
Bibliographic Details
Main Authors YU Weibo, Ku Shao-Yen, CHUANG Jui-Ping, LU Chen-Hsiang
Format Patent
LanguageEnglish
Published 20.10.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
NATURALLY-OCCURRING ELECTRICITY
SEMICONDUCTOR DEVICES
STATIC ELECTRICITY
Online AccessGet full text

Cover

More Information
Summary:A method for processing a semiconductor wafer is provided. The method includes performing a discharging process over the semiconductor wafer in a discharging chamber which is enclosed. The method further includes processing the semiconductor wafer by use of a first processing module after the discharging process. During the discharging process, charged particles applied on the semiconductor wafer are tuned based on the characteristics of the surface of the semiconductor wafer.
Bibliography:Application Number: US201514688191