Hot Melt Adhesive Composition with Ethylene/a-Olefin Multi-Block Copolymer

The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/α-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.

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Bibliographic Details
Main Authors RICKEY Cynthia L, WANG Alex Y, LIPI SHAN Colin
Format Patent
LanguageEnglish
Published 20.10.2016
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/α-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.
Bibliography:Application Number: US201415100497