METHOD FOR FABRICATING PATTERN USING SUPPORTING ASSEMBLY WITH ROLLING MEMBER DISPOSED BELOW SUPPORTING RODS AND SEMICONDUCTOR FABRICATION APPARATUS HAVING THE SUPPORTING ASSEMBLY

A method for fabricating a pattern on a semiconductor substrate, comprising the steps of: (a) providing the semiconductor substrate having a photosensitive layer thereon; (b) transmitting the semiconductor substrate to an exposure apparatus including several tubes; (c) providing the supporting assem...

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Bibliographic Details
Main Authors Wu Chien-Ju, Wu Ming-Sung
Format Patent
LanguageEnglish
Published 13.10.2016
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Summary:A method for fabricating a pattern on a semiconductor substrate, comprising the steps of: (a) providing the semiconductor substrate having a photosensitive layer thereon; (b) transmitting the semiconductor substrate to an exposure apparatus including several tubes; (c) providing the supporting assembly to support the tubes, where the supporting assembly includes a first supporting rod having several first parallel recesses, a second supporting rod disposed opposite to the first supporting rod, a bridging member connected to one end of the first supporting rod or one end of the second supporting rod; and a rolling member received by the bridging member; (d) providing a photomask to the exposure apparatus; and (e) transferring the pattern from the photomask to the photosensitive layer.
Bibliography:Application Number: US201615190165