METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED THEREBY

Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the fir...

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Bibliographic Details
Main Authors Salama Islam A, Eid Feras, Lee Kyu Oh, Kong Lay Wai, Zhou Zheng, Oster Sasha N, Soto Gonzalez Javier
Format Patent
LanguageEnglish
Published 29.09.2016
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:Methods of forming sensor integrated package devices and structures formed thereby are described. An embodiment includes providing a substrate core, wherein a first conductive trace structure and a second conductive trace structure are disposed on the substrate core, forming a cavity between the first conductive trace structure and the second conductive trace structure, and placing a magnet on a resist material disposed on a portion of each of the first and second conductive trace structures, wherein the resist material does not extend over the cavity.
Bibliography:Application Number: US201514671549