CONNECTION STRUCTURE OF HIGH-TEMPERATURE SUPERCONDUCTING WIRE PIECE, HIGH-TEMPERATURE SUPERCONDUCTING WIRE USING CONNECTION STRUCTURE, AND HIGH-TEMPERATURE SUPERCONDUCTING COIL USING CONNECTION STRUCTURE

A connection structure of a multi-layer wire includes at least a substrate, a high-temperature superconducting layer, a tape-type laminated body, a conductor layer, and a passage forming body. The high-temperature superconducting layer is formed on one surface of the substrate. The tape-type laminat...

Full description

Saved in:
Bibliographic Details
Main Authors IWAI Sadanori, KOYANAGI Kei, TAKAYAMA Shigeki, MIYAZAKI Hiroshi, TASAKI Kenji, TOSAKA Taizo
Format Patent
LanguageEnglish
Published 18.08.2016
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRICITY
INDUCTANCES
INSULATORS
MAGNETS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
Online AccessGet full text

Cover

More Information
Summary:A connection structure of a multi-layer wire includes at least a substrate, a high-temperature superconducting layer, a tape-type laminated body, a conductor layer, and a passage forming body. The high-temperature superconducting layer is formed on one surface of the substrate. The tape-type laminated body including at least the substrate and the high-temperature superconducting layer. The conductor layer covering an outer periphery of the tape-type laminated body. The passage forming body serving as a flowing path of a superconducting current generated in the high-temperature superconducting wire piece. The passage forming body is bonded by a bonding material is arranged on a side surface of the conductor layer, the side surface being located on an opposite side to the high-temperature superconducting layer with respect to the substrate.
Bibliography:Application Number: US201615042449