Method and Plant for Etching a Fluoropolymer Substrate

(Semi-) continuous etching method for a fluoropolymer substrate (10) comprising steps of feeding (22) said substrate (10) in the form of a continuous ribbon wherein said substrate defines a primary surface (12), subjecting to at least one etching operations (2) a part of the primary surface (12) by...

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Bibliographic Details
Main Authors Villano Massimo, Stella Pasquale
Format Patent
LanguageEnglish
Published 18.08.2016
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEPARATION
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:(Semi-) continuous etching method for a fluoropolymer substrate (10) comprising steps of feeding (22) said substrate (10) in the form of a continuous ribbon wherein said substrate defines a primary surface (12), subjecting to at least one etching operations (2) a part of the primary surface (12) by means of an adhesion-promoting solution comprising a complex of an alkali metal in naphthalene, washing (4) the primary surface (12) wetted by the adhesion-promoting solution by means of a washing solution (42) comprising aqueous acetic acid/formic acid, and selectively separating a concentrated solution (24) of acetic acid/formic acid from the washing solution (42) by means of inverse osmosis operations (6, 8) at ▪ increasing pressures, and re-introducing at least a portion of the concentrated solution (24) of acetic acid/formic acid in the washing solution (42) to create a recirculation. The invention further relates to an etching plant.
Bibliography:Application Number: US201315022150