SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

A method of selectively locating a barrier layer on a substrate includes forming a barrier layer on a surface of the substrate. The barrier layer comprises of a metal element and a non-metal element. The barrier layer may also be formed from a metal element and non-metal element. The method further...

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Main Authors SCHULER JENNIFER D, TESSLER CHRISTOPHER L, SOUTER MATTHEW E, ERWIN BRIAN M, POLOMOFF NICHOLAS A, BROVMAN YURI M
Format Patent
LanguageEnglish
Published 14.07.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of selectively locating a barrier layer on a substrate includes forming a barrier layer on a surface of the substrate. The barrier layer comprises of a metal element and a non-metal element. The barrier layer may also be formed from a metal element and non-metal element. The method further includes forming an electrically conductive film layer on the barrier layer, and forming a metallic portion in the electrically conductive film layer. The method further includes selectively ablating portions of the barrier layer from the dielectric layer to selectively locate place the barrier layer on the substrate.
Bibliography:Application Number: US201615072685