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Summary:Disclosed herein is a device comprising an electrode pair comprising a first electrode and a second electrode; a nanogap channel; wherein a portion of the nanogap channel is sandwiched between the first electrode and the second electrode; wherein at least a portion of the first electrode directly faces at least a portion of the second electrode, across the nanogap channel; wherein the portion of the first electrode and the portion of the second electrode are exposed to an interior of the nanogap channel; and wherein the first electrode or the second electrode comprises doped diamond, silicon carbide or a combination thereof. Also disclosed herein is a method comprising forming on a carrier substrate a first material layer comprising doped diamond, silicon carbide or a combination thereof; bonding the first material layer onto an electrical circuit.
Bibliography:Application Number: US201414583373