SEMICONDUCTOR DEVICE THAT ACCOMMODATES THERMAL EXPANSION OF AN ENCAPSULANT

A semiconductor device comprising a first conductor, a semiconductor die, a second conductor, an encapsulant, a first body, and a second body is disclosed. The semiconductor die may be coupled to the first conductor and the second conductors. The encapsulant may be encapsulating the semiconductor di...

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Bibliographic Details
Main Authors YAP EIT THIAN, TAN KHENG LENG, NG KEAT CHUAN
Format Patent
LanguageEnglish
Published 09.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device comprising a first conductor, a semiconductor die, a second conductor, an encapsulant, a first body, and a second body is disclosed. The semiconductor die may be coupled to the first conductor and the second conductors. The encapsulant may be encapsulating the semiconductor die and may comprise an illumination surface where light emitted and detected by the semiconductor device substantially passes through. The first and second conductors and the first and second bodies are interconnected by the encapsulant. A portion of the encapsulant other than the illumination surface is exposed by a gap between the first and second bodies so as to absorb stress resulting from temperature-induced movement of the encapsulant.
Bibliography:Application Number: US201414559628