WIRING STRUCTURE FOR TRENCH FUSE COMPONENT WITH METHODS OF FABRICATION

The present disclosure generally relates to a wiring structure for a fuse component and corresponding methods of fabrication. A wiring structure for a fuse component according to the present disclosure can include: a first electrical terminal embedded within a doped conductive layer, the doped condu...

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Bibliographic Details
Main Authors IYER SUBRAMANIAN S, MACIEJEWSKI EDWARD P, PEI CHENGWEN, KIRIHATA TOSHIAKI, WEHELLA-GAMAGE DEEPAL U
Format Patent
LanguageEnglish
Published 09.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure generally relates to a wiring structure for a fuse component and corresponding methods of fabrication. A wiring structure for a fuse component according to the present disclosure can include: a first electrical terminal embedded within a doped conductive layer, the doped conductive layer being positioned between two insulator layers of an integrated circuit (IC) structure; a dielectric liner positioned between the first electrical terminal and the doped conductive layer; a second electrical terminal embedded within the doped conductive layer; wherein each of the first electrical terminal and the second electrical terminal are further embedded in one of the two insulator layers, and the dielectric liner is configured to degrade upon becoming electrically charged.
Bibliography:Application Number: US201514876009