ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

• Main Author: ITO HIROHIDE
• Format: Patent
• Language: English
• Published: 02.06.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An object of the present invention is to provide an electronic device in which permeation of water content and oxygen from a bonding part is decreased, and which is excellent in stability, and a method for manufacturing the electronic device. The present invention relates to an electronic device including a substrate, an electronic element main body on the substrate, an electrode that is connected to the electronic element main body, a silicon-containing film that coats at least the electrode, and a sealing substrate that is bonded to the substrate via a bonding part that has the silicon-containing film and is disposed on the surrounding of the electronic element main body, to seal the electronic element main body, in which at least one of the substrate and the sealing substrate is a gas barrier film, and the silicon-containing film has a composition represented by the following chemical formula (1): in which x, y and z are respectively atomic ratios of oxygen, nitrogen and carbon to silicon, and satisfy 0 y<0.3, 3<2x+5y 5 and 0.01<z<1, or satisfy 0.3 y<0.7, 3<2x+5y 5 and 0 z<1.