METHOD AND SYSTEM FOR PULL TESTING OF WIRE BONDS

• Main Authors: SONG KENG YEW, TAN QING LE, LUO JIA LE, WANG YI BIN, ZHENG LIN WEI
• Format: Patent
• Language: English
• Published: 02.06.2016
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MACHINE TOOLS; MEASURING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICS; SOLDERING OR UNSOLDERING; TESTING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.