METHOD AND SYSTEM FOR PULL TESTING OF WIRE BONDS

A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wir...

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Bibliographic Details
Main Authors SONG KENG YEW, TAN QING LE, LUO JIA LE, WANG YI BIN, ZHENG LIN WEI
Format Patent
LanguageEnglish
Published 02.06.2016
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MACHINE TOOLS
MEASURING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PHYSICS
SOLDERING OR UNSOLDERING
TESTING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.
Bibliography:Application Number: US201414558395