MINIMUM-SPACING CIRCUIT DESIGN AND LAYOUT FOR PICA

Methods for testing the resolution of an imaging device include forming a plurality of semiconductor devices having proximal light emitting regions, such that the light emitting regions are grouped into distinct shapes separated by a distance governed by a target resolution size. The semiconductor d...

Full description

Saved in:
Bibliographic Details
Main Authors AINSPAN HERSCHEL A, STELLARI FRANCO, KIM SEONGWON, WEGER ALAN J
Format Patent
LanguageEnglish
Published 26.05.2016
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Methods for testing the resolution of an imaging device include forming a plurality of semiconductor devices having proximal light emitting regions, such that the light emitting regions are grouped into distinct shapes separated by a distance governed by a target resolution size. The semiconductor devices are activated by providing an input signal. Light emissions from one or more of the activated semiconductor devices are suppressed by providing one or more select signals.
Bibliography:Application Number: US201514939788