MINIMUM-SPACING CIRCUIT DESIGN AND LAYOUT FOR PICA
Methods for testing the resolution of an imaging device include forming a plurality of semiconductor devices having proximal light emitting regions, such that the light emitting regions are grouped into distinct shapes separated by a distance governed by a target resolution size. The semiconductor d...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
26.05.2016
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Subjects | |
Online Access | Get full text |
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Summary: | Methods for testing the resolution of an imaging device include forming a plurality of semiconductor devices having proximal light emitting regions, such that the light emitting regions are grouped into distinct shapes separated by a distance governed by a target resolution size. The semiconductor devices are activated by providing an input signal. Light emissions from one or more of the activated semiconductor devices are suppressed by providing one or more select signals. |
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Bibliography: | Application Number: US201514939788 |