Detector assembly using vertical wire bonds and compression decals

An imaging sensor includes a first monolithic semiconductor plate having an upper surface and a lower surface; a substantially continuous cathode deposited on the upper surface; an array of anode pads on the lower surface, each anode pad defining an individual pixel; a readout device having an array...

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Bibliographic Details
Main Author CLAYTON JAMES E
Format Patent
LanguageEnglish
Published 26.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An imaging sensor includes a first monolithic semiconductor plate having an upper surface and a lower surface; a substantially continuous cathode deposited on the upper surface; an array of anode pads on the lower surface, each anode pad defining an individual pixel; a readout device having an array of readout pads on its upper surface, each readout pad corresponding to a respective anode pad and alignable therewith; and, a plurality of parallel, vertical wire bonds interconnecting the semiconductor plate and the readout device, with each wire connecting one anode pad to its respective readout pad.
Bibliography:Application Number: US201514756679