PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD
A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with intervals between each other, is formed in a rectangular region on a surface layer, among the plurality of conductive layers, when viewed in a direc...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
19.05.2016
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with intervals between each other, is formed in a rectangular region on a surface layer, among the plurality of conductive layers, when viewed in a direction perpendicular to the surface layer. The land group is arrayed in a triangular lattice manner. The land group is arranged so that a smallest angle, among angles formed between one side of the rectangular region and respective three sides of the triangular lattice, is 7° or more and 23° or less. |
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| AbstractList | A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with intervals between each other, is formed in a rectangular region on a surface layer, among the plurality of conductive layers, when viewed in a direction perpendicular to the surface layer. The land group is arrayed in a triangular lattice manner. The land group is arranged so that a smallest angle, among angles formed between one side of the rectangular region and respective three sides of the triangular lattice, is 7° or more and 23° or less. |
| Author | MIYAKE HIROYUKI MURAI YUSUKE SEKIGUCHI KIYOSHI |
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| Notes | Application Number: US201514944051 |
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| RelatedCompanies | CANON KABUSHIKI KAISHA |
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| Snippet | A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD |
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