PRINTED WIRING BOARD, SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD

• Main Authors: SEKIGUCHI KIYOSHI, MURAI YUSUKE, MIYAKE HIROYUKI
• Format: Patent
• Language: English
• Published: 19.05.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A printed wiring board includes conductive layers laminated with insulator layers interposed. A land group including a plurality of lands arranged with intervals between each other, is formed in a rectangular region on a surface layer, among the plurality of conductive layers, when viewed in a direction perpendicular to the surface layer. The land group is arrayed in a triangular lattice manner. The land group is arranged so that a smallest angle, among angles formed between one side of the rectangular region and respective three sides of the triangular lattice, is 7° or more and 23° or less.