SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE
A semiconductor device includes a semiconductor chip having a first main surface and a second main surface. A chip electrode is disposed on the first main surface. The chip electrode includes a first metal layer and wherein the first metal layer is arranged between the semiconductor chip and the sec...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English |
Published |
05.05.2016
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Subjects | |
Online Access | Get full text |
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Abstract | A semiconductor device includes a semiconductor chip having a first main surface and a second main surface. A chip electrode is disposed on the first main surface. The chip electrode includes a first metal layer and wherein the first metal layer is arranged between the semiconductor chip and the second metal layer. |
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AbstractList | A semiconductor device includes a semiconductor chip having a first main surface and a second main surface. A chip electrode is disposed on the first main surface. The chip electrode includes a first metal layer and wherein the first metal layer is arranged between the semiconductor chip and the second metal layer. |
Author | FASTNER ULRIKE AHLERS DIRK WEILNBOECK FLORIAN MATOY KURT KRIVEC STEFAN GASSER KARL-HEINZ FISCHER PETRA HENNECK STEPHAN |
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RelatedCompanies | INFINEON TECHNOLOGIES AG |
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Snippet | A semiconductor device includes a semiconductor chip having a first main surface and a second main surface. A chip electrode is disposed on the first main... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE |
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