SEMICONDUCTOR DEVICE HAVING A STRESS-COMPENSATED CHIP ELECTRODE

A semiconductor device includes a semiconductor chip having a first main surface and a second main surface. A chip electrode is disposed on the first main surface. The chip electrode includes a first metal layer and wherein the first metal layer is arranged between the semiconductor chip and the sec...

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Main Authors FISCHER PETRA, GASSER KARL-HEINZ, AHLERS DIRK, WEILNBOECK FLORIAN, MATOY KURT, KRIVEC STEFAN, FASTNER ULRIKE, HENNECK STEPHAN
Format Patent
LanguageEnglish
Published 05.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a semiconductor chip having a first main surface and a second main surface. A chip electrode is disposed on the first main surface. The chip electrode includes a first metal layer and wherein the first metal layer is arranged between the semiconductor chip and the second metal layer.
Bibliography:Application Number: US201514932548