METHOD OF FABRICATING LIGHT-EMITTING DEVICE PACKAGE

A method of fabricating a light-emitting device package includes preparing a carrier including a first surface and a second surface disposed opposite the first surface, forming a phosphor layer on the first surface of the carrier, emitting first light from a test light-emitting device toward the sec...

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Bibliographic Details
Main Authors KWAK YOUNG-SUN, IM JAE-HYUNG, JUNG RAPHAEL
Format Patent
LanguageEnglish
Published 07.04.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of fabricating a light-emitting device package includes preparing a carrier including a first surface and a second surface disposed opposite the first surface, forming a phosphor layer on the first surface of the carrier, emitting first light from a test light-emitting device toward the second surface of the carrier, analyzing second light passing through the phosphor layer, and determining a thickness of the phosphor layer based on the analysis.
Bibliography:Application Number: US201514741192