RESIN BONDING DEVICE

• Main Author: KAWASAKI HIROAKI
• Format: Patent
• Language: English
• Published: 31.03.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present invention provides a resin bonding device comprising: a resin melting injection device A having: a cylinder 1 having an outlet member 5 with a nozzle part formed at a tip-end injection side, a stopper part 6 provided at a rear side for fixation or moving, and a pellet supply opening 11a at an intermediate position; a melting device 2 having a plurality of melting holes 22 formed communicating from inflow-side large openings 22a to outflow-side small openings 22b in the longitudinal direction of a device main body 21, the melting device 2 having a diameter equal to an inner diameter of the cylinder 1; and a heating unit 4 for heating the melting device 2, in which the melting device 2 is provided to be movable or fixed in the cylinder 1; and an adapter 8 that applies the molten resin q injected from the outlet member, to at least one side surface of a first member and a second member and prevents the molten resin q from escaping to resin-bond the first member and the second member to each other.