RESIN BONDING DEVICE
The present invention provides a resin bonding device comprising: a resin melting injection device A having: a cylinder 1 having an outlet member 5 with a nozzle part formed at a tip-end injection side, a stopper part 6 provided at a rear side for fixation or moving, and a pellet supply opening 11a...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
31.03.2016
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The present invention provides a resin bonding device comprising: a resin melting injection device A having: a cylinder 1 having an outlet member 5 with a nozzle part formed at a tip-end injection side, a stopper part 6 provided at a rear side for fixation or moving, and a pellet supply opening 11a at an intermediate position; a melting device 2 having a plurality of melting holes 22 formed communicating from inflow-side large openings 22a to outflow-side small openings 22b in the longitudinal direction of a device main body 21, the melting device 2 having a diameter equal to an inner diameter of the cylinder 1; and a heating unit 4 for heating the melting device 2, in which the melting device 2 is provided to be movable or fixed in the cylinder 1; and an adapter 8 that applies the molten resin q injected from the outlet member, to at least one side surface of a first member and a second member and prevents the molten resin q from escaping to resin-bond the first member and the second member to each other. |
---|---|
Bibliography: | Application Number: US201514964692 |