Embedding additive particles in encapsulant of electronic device

An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules co...

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Bibliographic Details
Main Authors MAHLER JOACHIM, GOH SOON LOCK, LEE SWEE KAH, KRISHNAN JAGEN, TAI CHEW THENG, LIM POH CHENG, TEH PEH HEAN, TAN YIK YEE
Format Patent
LanguageEnglish
Published 03.03.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
Bibliography:Application Number: US201514835750