METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES

A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only an...

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Main Authors CHOU MU HUNG, FISCHER CHRISTIAN THOMAS, WIRNSBERGER THOMAS, KUMNIG FRANZ, DYLEWICZ RAFAL RYSZARD, BERRY, III IVAN L, LAVDOVSKY NATHAN, OBWEGER RAINER, BALDARO ALESSANDRO, GLEISSNER ANDREAS
Format Patent
LanguageEnglish
Published 03.03.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.
Bibliography:Application Number: US201414469363