Leadframe Strip with Sawing Enhancement Feature

• Main Authors: ZHOU SEE THIONG, CHET YONG WAE, YEAP LIM LAY, LI TAI CHIEW, BOON TAY WEE
• Format: Patent
• Language: English
• Published: 25.02.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A leadframe strip includes a plurality of leads chemically etched into a metal sheet, a plurality of support structures chemically etched into the metal sheet, and a plurality of connecting structures chemically etched into the metal sheet. Each of the connecting structures is integrally connected at a first end to one of the leads and integrally connected at a second end to one of the support structures so that the leads are held in place by the support structures. The width of each connecting structure is at a minimum between the first and second ends of that connecting structure, increases from the minimum in a direction toward the first end, and increases from the minimum in a direction toward the second end. A method of manufacturing such a leadframe strip is also provided.