CIRCUIT CONNECTION STRUCTURE OF TOUCH SENSOR PANEL

Disclosed is a capacitive touch sensor panel. The panel includes a first substrate, a second substrate, a first conductive connecting layer, a second conductive connecting layer, an insulative opaque layer, and a grounding layer. Each substrate comprises a sensing region and a connecting region surr...

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Bibliographic Details
Main Authors LIN TA-HU, WANG KUEIING
Format Patent
LanguageEnglish
Published 28.01.2016
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:Disclosed is a capacitive touch sensor panel. The panel includes a first substrate, a second substrate, a first conductive connecting layer, a second conductive connecting layer, an insulative opaque layer, and a grounding layer. Each substrate comprises a sensing region and a connecting region surrounding the sensing region. The first conductive connecting layer is disposed on the first substrate in the connecting region. The insulative opaque layer is disposed on the second substrate while the grounding layer may be disposed above or under the insulative opaque layer and, at the same time, disposed above the first conductive connecting layer. The second conductive connecting layer is disposed under the insulative opaque layer and may be adjacent to the grounding layer.
Bibliography:Application Number: US201414341845