Vacuum Chuck with Polymeric Embossments

A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the ba...

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Bibliographic Details
Main Authors GLASKO JOHN, LIN I-KUAN, COOKE RICHARD A
Format Patent
LanguageEnglish
Published 31.12.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
Bibliography:Application Number: US201414764436