ELECTRONIC COMPONENT PACKAGE

Provided is an electronic component package that does not lower reliability while enabling miniaturization and high performance of the electronic component package. The electronic component package includes a main substrate, a first electronic component provided on a main surface of the main substra...

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Bibliographic Details
Main Authors HAGIHARA KIYOMI, ITOU FUMITO, OTA YUKITOSHI
Format Patent
LanguageEnglish
Published 10.12.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Provided is an electronic component package that does not lower reliability while enabling miniaturization and high performance of the electronic component package. The electronic component package includes a main substrate, a first electronic component provided on a main surface of the main substrate, a frame body disposed so as to face the main surface of the main substrate, and a first connection terminal and a second connection terminal disposed on the main surface of the main substrate along a first side of the frame body. The second connection terminal is disposed on the first side of the frame body at a position facing a vicinity of a midpoint of a side of the first electronic component, and the second connection terminal has an area larger than an area of the first connection terminal.
Bibliography:Application Number: US201514821680