INTEGRATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION

An integrated electronic package includes an integrated circuit (IC) die and conductive discrete components. Electrical interconnects are formed directly between bond pads on an active side of the IC die and contacts on the conductive discrete components without an intervening lead frame. The IC die...

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Bibliographic Details
Main Author YAP WENG F
Format Patent
LanguageEnglish
Published 10.12.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated electronic package includes an integrated circuit (IC) die and conductive discrete components. Electrical interconnects are formed directly between bond pads on an active side of the IC die and contacts on the conductive discrete components without an intervening lead frame. The IC die, conductive discrete components and electrical interconnects are embedded in an encapsulation material. Contact surfaces of at least some of the conductive discrete components are exposed from the encapsulation material and can be attached to a printed circuit board in order to mount the integrated electronic package to the printed circuit board.
Bibliography:Application Number: US201414296835