CIRCUIT BOARD

The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole...

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Main Authors SIMONE CHRISTOPHER DENNIS, HAEGER CARL ROBERT, COX SIDNEY G, WESSEL RICHARD A
Format Patent
LanguageEnglish
Published 26.11.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Abstract The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4′-oxydianiline. The circuit board does not have an adhesive layer between the first imaged metal layer and the polyimide coverlay.
AbstractList The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4′-oxydianiline. The circuit board does not have an adhesive layer between the first imaged metal layer and the polyimide coverlay.
Author COX SIDNEY G
WESSEL RICHARD A
HAEGER CARL ROBERT
SIMONE CHRISTOPHER DENNIS
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Snippet The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay...
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ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Title CIRCUIT BOARD
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