CIRCUIT BOARD

The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole...

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Bibliographic Details
Main Authors SIMONE CHRISTOPHER DENNIS, HAEGER CARL ROBERT, COX SIDNEY G, WESSEL RICHARD A
Format Patent
LanguageEnglish
Published 26.11.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4′-oxydianiline. The circuit board does not have an adhesive layer between the first imaged metal layer and the polyimide coverlay.
Bibliography:Application Number: US201314409958