CIRCUIT BOARD
The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
26.11.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure is directed to a circuit board having a first electrically insulating layer, a first imaged metal layer and a first polyimide coverlay derived from 100 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4′-oxydianiline. The circuit board does not have an adhesive layer between the first imaged metal layer and the polyimide coverlay. |
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Bibliography: | Application Number: US201314409958 |