DEVICE FOR NAIL APPLIQUE TRANSFER, SHEET OF NAIL APPLIQUES AND METHOD FOR NAIL APPLIQUE TRANSFER

Disclosed is a die-cut device for nail applique transfer. The device includes a thin film element having a proximal end, a distal end opposite the proximal end, and a lower surface and forming a nail applique. The device includes an adhesive layer disposed on the lower surface of the thin film eleme...

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Bibliographic Details
Main Authors KIM DONG SUNG, CHOI KYUNG SIK, PARK JU YOUNG, KIM HYUN SURK, CHOI JEONG RIM, KIM BO MI
Format Patent
LanguageEnglish
Published 19.11.2015
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Summary:Disclosed is a die-cut device for nail applique transfer. The device includes a thin film element having a proximal end, a distal end opposite the proximal end, and a lower surface and forming a nail applique. The device includes an adhesive layer disposed on the lower surface of the thin film element and an application tab detachably attached to a portion of the adhesive layer adjacent to the distal end of the thin film element. The adhesive layer has a first portion and a second portion. The first portion of the adhesive layer is adjacent to the distal end of the thin film element and is covered with the application tab. The second portion of the adhesive layer remains exposed for transfer of the nail applique to a fingernail or toenail. The application tab is suitable for a user to grasp when the nail applique is transferred to the fingernail or toenail.
Bibliography:Application Number: US201514712555