MULTI-LAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTI-LAYER SUBSTRATE

The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upp...

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Bibliographic Details
Main Authors PARK JONG GYU, YU HAN YEOL
Format Patent
LanguageEnglish
Published 05.11.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
WAVEGUIDES
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Summary:The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.
Bibliography:Application Number: US201514699465