ULTRASONIC PROBE

Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housi...

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Bibliographic Details
Main Authors KIM YOUNGIL, CHO KYUNGIL, SONG JONG KEUN, KIM BAEHYUNG, LEE SEUNGHEUN
Format Patent
LanguageEnglish
Published 15.10.2015
Subjects
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Summary:Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.
Bibliography:Application Number: US201514613769