LIGHT-EMITTING DIODE HAVING A SILICON SUBMOUNT AND LIGHT-EMITTING DIODE LAMP
A light-emitting diode having a silicon submount includes a silicon submount and a light-emitting diode (LED) chip. The silicon submount includes a power management integrated circuit formed in an inside of the silicon submount, a P-electrode formed on a bottom side thereof, an N-electrode formed on...
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Main Author | |
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Format | Patent |
Language | English |
Published |
01.10.2015
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Subjects | |
Online Access | Get full text |
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Summary: | A light-emitting diode having a silicon submount includes a silicon submount and a light-emitting diode (LED) chip. The silicon submount includes a power management integrated circuit formed in an inside of the silicon submount, a P-electrode formed on a bottom side thereof, an N-electrode formed on the bottom side thereof, and a heat dissipation ground portion formed on the bottom side thereof. The power management integrated circuit is electrically coupled to the P-electrode and the N-electrode. The LED chip is eutecticly bonded to a top side of the silicon submount, and the LED chip is electrically coupled to the P-electrode and the N-electrode. A heat-dissipation channel is defined from the LED chip to the heat dissipation ground portion via the inside of the silicon submount. The power management integrated circuit replaces a conventional power supply controller, thereby providing a more optimized LED. |
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Bibliography: | Application Number: US201414542609 |