PRESSURE SENSOR DEVICE WITH THROUGH SILICON VIA
A semiconductor pressure sensor device having a pressure-sensing die electrically connected to a microcontrol unit (MCU) using either through silicon vias (TSVs) or flip-chip bumps. An active surface of the pressure-sensing die is in facing relationship with the MCU. These embodiments avoid the need...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
24.09.2015
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor pressure sensor device having a pressure-sensing die electrically connected to a microcontrol unit (MCU) using either through silicon vias (TSVs) or flip-chip bumps. An active surface of the pressure-sensing die is in facing relationship with the MCU. These embodiments avoid the need to used bonds to electrically connect the pressure-sensing die to the MCU, thereby saving time, reducing size, and reducing cost. |
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Bibliography: | Application Number: US201414220121 |