ASSEMBLY AND METHOD OF PRETREATING LOCALIZED AREAS OF PARTS FOR JOINING
An assembly and a method of joining a first part with a second part at an attachment area that includes a localized area on the first part. The localized area is cleaned and activated by a plasma jet. An organosilicon composition is applied by plasma-enhanced chemical vapor deposition to the localiz...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
24.09.2015
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Subjects | |
Online Access | Get full text |
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Summary: | An assembly and a method of joining a first part with a second part at an attachment area that includes a localized area on the first part. The localized area is cleaned and activated by a plasma jet. An organosilicon composition is applied by plasma-enhanced chemical vapor deposition to the localized area. An adhesive is applied to the localized area and the second part is mechanically fastened to the first part in the localized area. |
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Bibliography: | Application Number: US201414222555 |