SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE

A method for fabricating a base for a semiconductor package is provided. The method operates by providing a carrier with conductive seed layers on the top surface and the bottom surface of the carrier, forming radio-frequency (RF) devices respectively on the conductive seed layers, laminating a firs...

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Bibliographic Details
Main Authors HSU WEN-SUNG, YU TA-JEN
Format Patent
LanguageEnglish
Published 17.09.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for fabricating a base for a semiconductor package is provided. The method operates by providing a carrier with conductive seed layers on the top surface and the bottom surface of the carrier, forming radio-frequency (RF) devices respectively on the conductive seed layers, laminating a first base material layer and a second base material layer respectively on the conductive seed layers, covering the RF devices, and separating the first base material layer the second base material layer, which contain the RF devices thereon, from the carrier to form a first base and a second base.
Bibliography:Application Number: US201514663772