GRINDSTONE AND GRINDING/POLISHING DEVICE USING SAME
[Problem] To provide a grindstone and a grinding/polishing device using same with which, in addition to it being possible to perform the three processes of rough processing, lapping, and polishing with the same device: double-sided processing is also possible; processing rate does not decrease even...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
17.09.2015
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Subjects | |
Online Access | Get full text |
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Summary: | [Problem] To provide a grindstone and a grinding/polishing device using same with which, in addition to it being possible to perform the three processes of rough processing, lapping, and polishing with the same device: double-sided processing is also possible; processing rate does not decrease even when used continuously; and dressing can be omitted. [Solution] A grindstone for grinding/polishing workpieces, the grindstone being characterized in comprising multiple grindstone pillars, which are obtained from a binding agents and abrasive grains for grinding/polishing the workpieces and disposed in parallel with an axis (L) in the depth direction of the grinding/polishing surface, and the grindstone matrix integrally formed with the grindstone pillars, and a grinding/polishing device using said grindstone. |
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Bibliography: | Application Number: US201314433956 |