MECHANICALLY ANCHORED BACKSIDE C4 PAD

• Main Authors: FILIPPI RONALD G, ZHANG LIJUAN, KIM ANDREW T, KALTALIOGLU ERDEM, WANG PINGUAN
• Format: Patent
• Language: English
• Published: 10.09.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention relates generally to flip chip technology and more particularly, to a method and structure for fabricating a mechanically anchored controlled collapse chip connection (C4) pad on a semiconductor structure. In an embodiment, a method is disclosed that may include forming a bondi...